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Processing technology

  • Surface mount
  • BGA placement
  • COB multi-chip package
  • COB+SMT+welding+assembly
  • COB+soft braided welding
  • Ceramic plate hybrid circuit
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Leaders visit our company to visit and guide the work 2017/01/13
On the morning of January 12, Mr. Li Yanren, former director of Wuxi Economic and Trade Commission and honorary president of Wuxi Enterprise Association, and Mr. Yang Leiyi, vice general manager of China United Network Communications Co., L...
The Development Trend of Surface Mount Technology 2017/01/07
At present, the positioning of packaging technology from the connection, assembly and other general production technology gradually evolved to achieve a high degree of diversity of electronic information equipment is a key technology. Highe...
Introduction to Thick Film Circuit 2017/01/07
Thick film circuit is a kind of integrated circuit. It refers to the circuit element which has certain function on the substrate by the steps of printing, firing and welding resistance, inductance, capacitance, semiconductor element and int...
Features and Application of Thick Film Circuit 2017/01/07
Compared with thin film hybrid integrated circuits, thick film hybrid integrated circuit is characterized by more flexible design, simple process, low cost, especially suitable for many varieties of small batch production. In electrical per...
The characteristics of component placement 2017/01/07
The volume and weight of the SMD components are only about 1/10 of that of traditional cartridge components. Generally, the size of the electronic products is reduced by 40% to 60%, and the weight of the electronic components is reduced. 60...

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